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[Technical Information] Tips for Uniform Tape Application on Wafers

Introduction to the tape application process in the dicing process.

The "Tape Mount Handbook" is a technical document from Techno Vision, which develops and sells semiconductor manufacturing equipment, cleaning equipment, and post-process assembly equipment. This document includes an overview of the "Tape Application Process in the Dicing Process," as well as solutions to issues and details about the equipment. [Contents (partial)] ■ Overview ■ Tape Application ■ In the case of manual application ■ If you are already using a tape mount ■ Techno Vision manufactured mount *For more details, please refer to the PDF document or feel free to contact us.